Micro- and Opto-Electronic Materials and Structures: - download pdf or read online

By Ephraim Suhir, Y.C. Lee, C.P. Wong

ISBN-10: 0387279741

ISBN-13: 9780387279749

Micro- and Opto-Electronic fabrics and buildings: Physics, Mechanics, layout, Reliability, Packaging is the 1st finished connection with acquire and current the main, updated, in-depth, functional and easy-to-use info at the physics, mechanics, reliability and packaging of micro- and opto-electronic fabrics, assemblies, buildings and structures. The chapters in those volumes include summaries of the cutting-edge and current new details on lately constructed very important equipment or units. in addition, useful techniques are provided on tips to effectively observe present wisdom and lately constructed know-how to layout, manufacture and function workable, trustworthy and competitively priced digital elements or photonic units. The emphasis is at the technological know-how and engineering of digital and photonic packaging, on actual layout difficulties, demanding situations and strategies. quantity I specializes in physics and mechanics of micro- and opto-electronic buildings and structures, i.e., at the technology underpinnings of engineering tools and methods utilized in microelectronics and photonics. quantity II offers with a number of useful points of reliability and packaging of micro- and opto-electronic structures. across the world well-known specialists and international leaders particularly components of this department of utilized technological know-how and engineering contributed to the publication. themes addressed within the e-book comprise, yet aren't constrained to, the subsequent: physics and mechanics of polymer fabrics; underfills; electrically conductive adhesives; plastic applications of IC units; lead unfastened solders; flip-chip programs; transportable electronics; wirebond interconnects and metallurgical interconnections for harsh environments; reliability and pressure trying out and sped up lifestyles checking out; solder joint fabrics and applied sciences in addition to lead-free solder fabrics and joints; reliability of cellular digital items, photonic fabrics, optical fibers and energetic and passive optical parts; thermal phenomena in micro- and opto-electronic platforms and thermal stresses; adhesion difficulties and suggestions; skinny movie fabrics, physics and mechanics; photorefractive fabrics and units; nanomaterials and nanotechnology; multiphysics modeling and optimization applied sciences; experimental tools and strategies; trying out tools and methods, subjected to thermal loading, rigidity analyses of processed silicon wafers, and so forth. The publication is meant as a reference resource and as a handbook for electric, fabrics, mechanical, and reliability engineers, in addition to utilized physicists and fabrics scientists. The publication could be an important device for all those people who are concerned or drawn to state of the art within the research, layout and production of micro- and opto-electronic structures.

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Additional resources for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics Materials ... Physical Design Reliability and Packaging

Example text

3. 4. 5. 6. 7. 8. 4. 5. 1. Why do Products Fail? 2. 6. 1. 2. 3. 4. 5. 6. 7. 7. Further Reading 184 184 185 185 185 185 185 186 186 187 187 189 191 191 192 193 194 195 197 198 201 Chapter 8 How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests E. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 29. 30. 1. 2. 1.

2. 3. 4. 5. 6. 7. 7. Further Reading 184 184 185 185 185 185 185 186 186 187 187 189 191 191 192 193 194 195 197 198 201 Chapter 8 How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests E. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 29. 30. 1. 2. 1. 2. 3. 3. 1. 2. 4. 1. 2. 3. 5. 1. 2. 1. 2. 6. 7. C. 1. 2.

4. 5. 6. 2. 1. 2. 3. 3. 1. 2. 3. 4. 5. 6. 7. 8. 4. 5. 1. Why do Products Fail? 2. 6. 1. 2. 3. 4. 5. 6. 7. 7. Further Reading 184 184 185 185 185 185 185 186 186 187 187 189 191 191 192 193 194 195 197 198 201 Chapter 8 How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests E. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 1. 2. 3. 4. 5. 6. 7.

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics Materials ... Physical Design Reliability and Packaging by Ephraim Suhir, Y.C. Lee, C.P. Wong


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