Get Integrated Circuit Test Engineering: Modern Techniques PDF

By Ian A. Grout

ISBN-10: 1846280230

ISBN-13: 9781846280238

ISBN-10: 1846281733

ISBN-13: 9781846281730

Nearly sixty years in the past, the 1st profitable demonstration of the transistor proved to be the bring in of a brand new period of microelectronics. The ever-increasing complexity and useful velocity of microelectronic circuits now containing hundreds of thousands of transistors call for applicable and rigorous try engineering actions in the course of improvement and creation. try engineering should also be extra heavily interwoven with microelectronic layout. An knowing of circuit try engineering is essential to any scholar needing a occupation related to any degree within the layout or manufacture of built-in circuits.

Taking a three-pronged technique – facing try out engineering from traditional-test, layout and production view-points – Integrated Circuit attempt Engineering encapsulates the topic because it stands this day. After an creation overlaying historical past from easy checking out principles to tendencies in expertise, the reader learns about:

• fabrication strategies;

• a various and entire variety of precise exams and strategies calculated to educate you all of the exams you are going to require and the way to settle on which one(s) to take advantage of;

• easy methods to layout for testability;

• fault simulation;

• automated try out gear and

• the economics of checking out.

From a realistic point of view, the textual content includes:

• a number labored examples and routines including well-organized references and bibliography to help extra enquiry.

• An advent to numerous software program similar to MATLAB® and Spice explaining their use in checking out including that of IEEE-standard hardware-description languages Verilog®-HDL and VHDL.

• a chain of experiments in response to fabric which might be freely downloaded from teaching you within the development of a try association for MS home windows computers (functionality, schematic and printed-circuit-board layout)with visible easy courses to force the experiments.

Integrated Circuit attempt Engineering presents a thorough-going and illuminating creation to check engineering in analogue, electronic and mixed-signal built-in circuits. this article is a precious sensible studying instrument for complicated undergraduate and graduate digital engineering scholars, an outstanding educating source for his or her tutors and an invaluable advisor for the working towards digital engineer.

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The bipolar transistor is based around a sandwich of n and p-type silicon, see Fig. 3. NPN Transistor PNP Transistor Collector Emitter Circuit Schematic Base Base Emitter Collector Collector Emitter n Base p Basic Structure p Base n n p Emitter Collector Fig. 3. Bipolar transistor forms The basic operation, with reference to the NPN transistor, is that a current flowing into the base of the transistor (and exiting out of the emitter) allows for a larger collector current to flow from the collector through to the emitter.

Gate Source Drain Printed Gate Length (LM) tox Gate Oxide Source n+ Physical Gate Length (Leff) Printed Channel Width (W) Drain n+ p - substrate (bulk, body) Fig. 5. 3D view of the nMOS transistor (simplified) The printed gate length (LM), the physical gate length (LEFF – effective gate length) and the insulating gate oxide thickness (tox) are shown. The operation of the MOSFET is considered with respect to: • • Gate-source voltage (VGS) vs drain current (ID). Drain-source voltage (VDS) vs drain current (ID) for various gate-source voltage values.

Virtual Test reduces semiconductor product development time”, IEE Electronics and Communication Engineering Journal, April 2001, pp77-83 [22] Zorian Y. , “Guest Editors’ Introduction: Design for Yield and Reliability”, IEEE Design and Test of Computers, Vol. 21, No. 3, May-June 2004, pp177-182 [23] Raab W. , “Sun’s Big Splash”, IEEE Spectrum magazine, January 2005, pp50-54 [25] Hunter C. Vida-Torku E. , “Balancing Structured and Adhoc Design for Test: Testing of the PowerPC 603TM Microprocessor”, Proceedings of the International Test Conference, 1994, pp76-83 [26] United States Department of Defense, MIL-STD-883F, “Test Method Standard Microchips”, 18th June 2004 Chapter 2 Fabrication Processes for Integrated Circuits Integrated Circuit designs will be realised in one of a number of possible fabrication processes.

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Integrated Circuit Test Engineering: Modern Techniques by Ian A. Grout

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